Failure Analysis Engineer

13 Nov Failure Analysis Engineer

Role: Failure Analysis EngineerDuration:12-24 months with possible extension or conversionLocation: Menlo Park Or Fremont  officesJob Description As a Failure Analysis Engineer, the selected candidate will be responsible for conducting root cause investigation on various infrastructure/datacenter related failures. The candidate will be responsible for processing, receiving, and categorizing incoming RMAs, field returns, etc. The FA engineer will support sustainability, reliability, NPI programs and perform electrical fault isolation, nondestructive imaging, and destructive/physical failure analysis to determine the failure root cause. The candidate is responsible for lab upkeep, consumable inventory management, and capabilities identification for future expansion.  Responsibilities• Investigate datacenter failures (electrical, mechanical, electromechanical, and thermal), determine root cause, and propose corrective actions and solutions.• Read PCB layouts and schematics and plan an analysis approach to fault isolate the failure location before proceeding to physical failure analysis. • Experience in RCA for thermal induced failures in PCBs and electrical components. • Expert level experience with SEM, DBFIB, 2D/3D Xray, high frequency oscilloscopes, PDN analysis, elemental analysis, Spectroscopic analysis, thermal warpage, optical imaging techniques, polishing wheels, and chemical etching. • Drive investigation and resolution on qualification fallouts, product/process non-conformance, RMA events through the means of FA, fishbone, and 8D reporting. • Perform electrical failure analysis on failing server components – motherboards, CPUs, GPUs, DIMMs, etc. to isolate and understand failures. • Deep expertise in DDR5, PCIE gen5 related debugging and fault isolation. • Establish in-house FA lab with asset management to support sustainability of server fleet in datacenters, reliability on server life extension programs, and NPI/NPD projects. Requirements: • Masters in EE/Materials Science/Mechanical engineering with 8-10 years industry experience. • In-depth understanding of electrical circuitry, DDR, PCIE, and different high speed protocols. • Experience working on PCB, MLB, package, and die level failures. Good understanding of advanced packaging technologies. • Proficiency reading electrical schematics and PCB layouts (Cadence, Altium, OrCAD, etc.) to debug complex failures. • Expert-level hands-on experience with SEM/EDS, optical microscopy, FIB, Xray/uCT, chemical/mechanical polishing, decapping, dye-and-pry, spectroscopic approaches, thermal imaging, oscilloscopes, TDR, VNA, parametric testing, cross section analysis, CSAM and other failure analysis approaches. • Strong knowledge of: physics of failure and how common failure mechanisms would be triggered through accelerated testing (e.g. mechanical shock/vibration, thermal cycling/shock, powered humidity exposure, high-temperature degradation, HALT) • Can-do attitude and out-of-the-box thinking for unique failure cases. Ability to work on unique projects with minimal training and supervision